【7.4】Bond Connect Anniversary Summit 2023- Integrity, Innovation and Connectivity

Dear HKCAMA members,

Since launching in 2017, Bond Connect has played a key role in connecting China’s bond markets with international investors, expanding in both size and scope. Its average daily turnover has grown 14-fold since 2017, reaching RMB32 billion in 2022. And, the recent launch of Swap Connect is only set to underpin future growth, providing international bond investors with easier access to onshore hedging tools as the regional fixed income markets develop and expand. 

As a supporting partner, HKCAMA is delighted to invite you to the Bond Connect Anniversary Summit taking place on Tuesday, 4 July 2023, where we will celebrate the achievements of this pioneering platform and explore the latest developments shaping Bond Connect and China’s financial markets.

Bringing together government representatives, regulators, issuers, investors and market participants from across Mainland China and Hong Kong, the event will also take a closer look at the new opportunities emerging for RMB internationalisation, the latest updates on the Connect schemes and the trends shaping cross-border investment and financing.

View the latest event agenda and register your attendance by clicking on the link below. 

Event details

Date                      4 July 2023 (Tuesday)

Time                      9:00am - 1:05pm (HKT)

Format                 Hybrid

Venue                  HKEX Connect Hall, 1/F, One and Two Exchange Square, 8 Connaught Place, Central.

Language             English and Putonghua (simultaneous interpretation available)

Register Link: https://virtual.eventionapp.com/#/bondconnectsummit2023/reg/main

If you have any enquiries about the event, please contact bondconnect2023@pico.com.

If you have any other questions, please contact HKCAMA at info@hkcama.com.

Best regards,

HKCAMA Secretariat

香港中环康乐广场1号

怡和大厦4105 - 4109室

Suite 4105-4109, 41/F Jardine House, 1 Connaught Place,

Central, Hong Kong

Tel. + 852-3718-6299